K-band receiver front-end IC integrating micromachined filter and flip-chip assembled active devices

Author

Takahashi, K. ; Fujita, S. ; Sangawa, U. ; Ono, A. ; Urabe, T. ; Takeyama, S. ; Ogura, H. ; Yabuki, H.

Author_Institution

Matsushita Res. Inst. Tokyo Inc., Kawasaki, Japan

Volume

1

fYear

1999

fDate

13-19 June 1999

Firstpage

229

Abstract

A novel three-dimensional K-band receiver front-end IC was developed in which a micromachined low-loss filter and flip-chip devices ware integrated on a silicon substrate. An inverted microstrip line and a new resonator are newly introduced in the filter. Multilayered BCB and flip-chip bonding technologies are also adopted.

Keywords

flip-chip devices; hybrid integrated circuits; microassembling; micromachining; microwave links; millimetre wave filters; millimetre wave integrated circuits; millimetre wave receivers; passive filters; resonator filters; silicon; 3D hybrid IC; EHF; K-band receiver front-end IC; Si; Si substrate; benzocyclobutene thin film; flip-chip assembled active devices; flip-chip bonding technology; inverted microstrip line; low-loss filter; micromachined filter; multilayered BCB technology; resonator; three-dimensional IC; Assembly; Costs; Dielectric losses; Dielectric substrates; K-band; Millimeter wave technology; Propagation losses; Resonator filters; Silicon; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1999 IEEE MTT-S International

Conference_Location

Anaheim, CA, USA

Print_ISBN

0-7803-5135-5

Type

conf

DOI

10.1109/MWSYM.1999.779464

Filename

779464