• DocumentCode
    3419969
  • Title

    A Method of Using Audio Signal-to-Noise Measurements to Obtain Criterion Contours for the Probability Scoring Model for Scoring Voice Communications Reception

  • Author

    Sorkin, I.J. ; Kraus, A. ; Witter, T.J., Jr.

  • Author_Institution
    Textron´´s Bell Aerosystems Company Tucson, Arizona
  • fYear
    1968
  • fDate
    23-25 July 1968
  • Firstpage
    69
  • Lastpage
    74
  • Abstract
    The Probability Scoring Model used for electromagnetic compatibility analysis considers the probability of correct information transfer, written as P(R+), to determine link quality. Experience has shown that the smallest value of articulation index (AI) which consistently provides correct information transfer in the presence of normal language configuration is 0.7 in a scale ranging from 0 to 1, and that the largest value of AI for a nonuseful link is 0.3. AI has been shown to be a function of the link description (receiver/transmitter type and frequency), the interferer description (type and frequency), and the strength of the desired and interfering signal, SRF and I, respectively; hence, for any given communications system of such configuration that the link and interferer descriptions and frequencies are known, AI can be established as a function of SRF and I. Determination of AI requires the use of the Voice Interference Analysis System (VIAS), test equipment which is costly and not readily available to all potential users of the Electromagnetic Environmental Test Facility (EMETF) Probability Scoring Model. However, receiver audio signal-to-noise ratio (S/N) can be shown to be a function of the same variables. A nonlinear regression analysis line has been established by relating empirical audio S/N values to AI for AM, FM, and SSB link and interferer modulation combinations. Typical military communications sets were used. As a result of this analysis, the criterion values of 0.3 and 0.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility Symposium Record, 1968 IEEE
  • Conference_Location
    Seattle, WA, USA
  • ISSN
    0018-9375
  • Type

    conf

  • DOI
    10.1109/TEMC.1968.4307120
  • Filename
    4307120