Title :
A novel design concept for a super compact power amplifier module (SCPAM) using a multilayer substrate
Author :
Nishida, M. ; Murai, S. ; Banba, S. ; Yamaguchi, T. ; Sawai, T. ; Sawada, M.
Author_Institution :
Microelectron. Res. Center, Sanyo Electr. Co. Ltd., Osaka, Japan
Abstract :
This paper presents a novel circuit and layout design concept for a Super Compact Power Amplifier Module (SCPAM) using a multilayer substrate. This concept enables miniaturization of the module, while continuing to allow easy design and good performance. A 0.04 cc 1 W class module for mobile communication systems is demonstrated. A 0.02 cc module including this concept is also proposed.
Keywords :
UHF integrated circuits; UHF power amplifiers; hybrid integrated circuits; mobile radio; modules; 1 W; 1.4 GHz; L-band; layout design; miniaturization; mobile communication systems; multilayer substrate; super compact power amplifier module; Capacitors; Cellular phones; Circuit stability; FETs; Impedance; Nonhomogeneous media; Power amplifiers; Resistors; Roentgenium; Strips;
Conference_Titel :
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-5135-5
DOI :
10.1109/MWSYM.1999.779580
