DocumentCode
342023
Title
A novel design concept for a super compact power amplifier module (SCPAM) using a multilayer substrate
Author
Nishida, M. ; Murai, S. ; Banba, S. ; Yamaguchi, T. ; Sawai, T. ; Sawada, M.
Author_Institution
Microelectron. Res. Center, Sanyo Electr. Co. Ltd., Osaka, Japan
Volume
3
fYear
1999
fDate
13-19 June 1999
Firstpage
1103
Abstract
This paper presents a novel circuit and layout design concept for a Super Compact Power Amplifier Module (SCPAM) using a multilayer substrate. This concept enables miniaturization of the module, while continuing to allow easy design and good performance. A 0.04 cc 1 W class module for mobile communication systems is demonstrated. A 0.02 cc module including this concept is also proposed.
Keywords
UHF integrated circuits; UHF power amplifiers; hybrid integrated circuits; mobile radio; modules; 1 W; 1.4 GHz; L-band; layout design; miniaturization; mobile communication systems; multilayer substrate; super compact power amplifier module; Capacitors; Cellular phones; Circuit stability; FETs; Impedance; Nonhomogeneous media; Power amplifiers; Resistors; Roentgenium; Strips;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location
Anaheim, CA, USA
Print_ISBN
0-7803-5135-5
Type
conf
DOI
10.1109/MWSYM.1999.779580
Filename
779580
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