Title :
Investigation of cooling performance of micro-channel structure embedded in LTCC substrate for 3D micro-system
Author :
Du-wei Hu ; Min Miao ; Sheng-lin Ma ; Ru-niu Fang ; Shi-chao Guo ; Yu-feng Jin
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China
fDate :
Oct. 29 2012-Nov. 1 2012
Abstract :
The paper reports the design, fabrication and thermal property investigation of serpentine micro-channel structure embedded in Low Temperature Co-fired Ceramic (LTCC) substrate for thermal management of 3D micro-system. Serpentine micro-channel structure is about 2cm(length) × 2cm(width) × 2mm(thickness) in dimension and the micro-channel is about 200μm×200μm in its cross section. Infrared imaging is used to test temperature distribution of the whole LTCC substrate. Based on the test results, the cooling performance of the serpentine micro-channel is evaluated. With the present design of micro-channel, the experiment shows the maximum temperature of the substrate decreases from 85°C to 48°Cas the flow rate of deionized (DI) water through the micro-channel ranges from 0.59ml/min to 2.48ml/min. When the flow rate of DI water through micro-channel is increased with an increment of 0.5ml/min from 1.87ml/min, the decrease of maximum temperature of substrate is less than 2°C.
Keywords :
ceramic packaging; cooling; infrared imaging; micromechanical devices; thermal management (packaging); 3D microsystem; DI water; LTCC substrate; cooling performance; deionized water; flow rate; infrared imaging; low temperature cofired ceramic substrate; serpentine microchannel structure; temperature distribution; thermal management; thermal property investigation; Cooling; Fabrication; Heat transfer; Substrates; Surface topography; Water heating;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
DOI :
10.1109/ICSICT.2012.6467839
