Title :
Trends in microelectronics packaging and interconnection
Author :
Chung, Tom ; Haskell, Bert
Author_Institution :
Tandem Comput. Inc., Cupertino, CA, USA
Abstract :
Functions and definitions of electronics packaging - along with product-oriented electronics packaging and interconnection technologies, including roadmap and packaging requirements for portable electronics in the year 2000, are reviewed. It has been determined that high-density packaging is the major product driving force in today´s highly competitive electronics industry. Accordingly, major trends and developments in microelectronics packaging and interconnection are presented and discussed
Keywords :
integrated circuit interconnections; integrated circuit packaging; technological forecasting; electronics industry; microelectronics interconnection; microelectronics packaging; portable electronics; Bonding; Chip scale packaging; Electronics industry; Electronics packaging; Flip chip; Integrated circuit interconnections; Integrated circuit packaging; Microelectronics; Plastic packaging; Semiconductor device packaging;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.540987
