DocumentCode
3420587
Title
Credit risk evaluation of investment corporation bonds
Author
Tsuda, Hiroyuki ; Ando, Makoto
Author_Institution
Dept. of Math. Sci., Doshisha Univ., Kyoto, Japan
fYear
2013
fDate
13-13 July 2013
Firstpage
179
Lastpage
184
Abstract
In the present study, we use the concept of the straight coupon bond pricing model proposed by Tsuda (2006) to estimate a price evaluation model for investment corporation bonds: bonds issued by investment corporations for the purpose of raising funds. This model obtains credit risk information, such as default probability, from the market prices of bonds. The model simultaneously estimates implied default probability and recovery rate through comparison of the price fluctuation structure of issues. The market value of properties poses a problem since, as a general rule, real estate has low liquidity and transaction prices are not published. However, because investment corporations that issue investment corporation bonds proactively disclose information (property acquisition prices, NOI, etc.) about owned properties that serve as collateral assets, we can estimate the recovery rate from this information. Then, from market price data for investment corporation bonds, we can obtain new information, including the term structure of default probability for each bond rating and the validity of the pricing model.
Keywords
investment; pricing; probability; risk management; bond rating; credit risk evaluation; credit risk information; default probability; implied default probability estimation; investment corporation bonds; liquidity price; market prices; market value; price evaluation model; price fluctuation structure; recovery rate; straight coupon bond pricing model; transaction price; Companies; Correlation; Data models; Equations; Investment; Mathematical model; Pricing; Corporate bond pricing model; Credit risk; Default probability; Investment corporation bonds; J-REIT; Recovery rate;
fLanguage
English
Publisher
ieee
Conference_Titel
Computational Intelligence & Applications (IWCIA), 2013 IEEE Sixth International Workshop on
Conference_Location
Hiroshima
ISSN
1883-3977
Print_ISBN
978-1-4673-5725-8
Type
conf
DOI
10.1109/IWCIA.2013.6624811
Filename
6624811
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