• DocumentCode
    3420587
  • Title

    Credit risk evaluation of investment corporation bonds

  • Author

    Tsuda, Hiroyuki ; Ando, Makoto

  • Author_Institution
    Dept. of Math. Sci., Doshisha Univ., Kyoto, Japan
  • fYear
    2013
  • fDate
    13-13 July 2013
  • Firstpage
    179
  • Lastpage
    184
  • Abstract
    In the present study, we use the concept of the straight coupon bond pricing model proposed by Tsuda (2006) to estimate a price evaluation model for investment corporation bonds: bonds issued by investment corporations for the purpose of raising funds. This model obtains credit risk information, such as default probability, from the market prices of bonds. The model simultaneously estimates implied default probability and recovery rate through comparison of the price fluctuation structure of issues. The market value of properties poses a problem since, as a general rule, real estate has low liquidity and transaction prices are not published. However, because investment corporations that issue investment corporation bonds proactively disclose information (property acquisition prices, NOI, etc.) about owned properties that serve as collateral assets, we can estimate the recovery rate from this information. Then, from market price data for investment corporation bonds, we can obtain new information, including the term structure of default probability for each bond rating and the validity of the pricing model.
  • Keywords
    investment; pricing; probability; risk management; bond rating; credit risk evaluation; credit risk information; default probability; implied default probability estimation; investment corporation bonds; liquidity price; market prices; market value; price evaluation model; price fluctuation structure; recovery rate; straight coupon bond pricing model; transaction price; Companies; Correlation; Data models; Equations; Investment; Mathematical model; Pricing; Corporate bond pricing model; Credit risk; Default probability; Investment corporation bonds; J-REIT; Recovery rate;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Intelligence & Applications (IWCIA), 2013 IEEE Sixth International Workshop on
  • Conference_Location
    Hiroshima
  • ISSN
    1883-3977
  • Print_ISBN
    978-1-4673-5725-8
  • Type

    conf

  • DOI
    10.1109/IWCIA.2013.6624811
  • Filename
    6624811