3D multilayer monolithic microwave (M/sup 3/) passive transmitter module

Author

Ferendeci, A.M. ; Bosui Liu ; Ho Huang ; Mah, M. ; Lee Liou

Author_Institution

Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA

Volume

2

fYear

1999

fDate

13-19 June 1999

Firstpage

445

Abstract

An X-band multilayer monolithic microwave (M/sup 3/) filter and patch antenna were designed, processed and characterized to demonstrate a three dimensional X-band passive transmitter. Multiple layers of polyimide and metal were deposited on a metalized silicon wafer. A filter and a patch antenna which were processed at two different layers were coupled through a slot on a common ground plane. The X-band 3D-M/sup 3/ passive transmitter was characterized for the radiation patterns.

Keywords

MMIC; antenna phased arrays; antenna radiation patterns; integrated circuit interconnections; microstrip antenna arrays; microwave filters; transmitting antennas; 3D multilayer monolithic microwave circuit; X-band; common ground plane; metalized silicon wafer; microwave filter; passive transmitter module; patch antenna; polyimide multiple layers; radiation patterns; Coplanar waveguides; Coupling circuits; Dielectrics; Integrated circuit interconnections; MMICs; Microwave filters; Nonhomogeneous media; Patch antennas; Silicon; Transmitters;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1999 IEEE MTT-S International

Conference_Location

Anaheim, CA, USA

Print_ISBN

0-7803-5135-5

Type

conf

DOI

10.1109/MWSYM.1999.779798

Filename

779798