Title :
AlN HTCC super miniaturized millimeterwave transceiver MCMs, the novel structure for the high reliability, the high performance and the mass productivity
Author :
Kaneko, T. ; Watanabe, H. ; Akaishi, M. ; Wada, K.
Author_Institution :
Microwave & Satellite Commun. Div., NEC Corp., Yokohama, Japan
Abstract :
NEC has developed a novel structure of millimeterwave multi-chip-modules (MCMs) for the radiocommunications systems based on the aluminum nitride (AlN) high temperature cofired ceramic (HTCC). This package has the LCC and a waveguide I/O structure. We realized both excellent electrical performance and high reliability with more than 10-years of MTTF, for 1.37 inch/spl times/1.37 inch size of the super miniaturized and extremely simplified structure.
Keywords :
MIMIC; aluminium compounds; ceramic packaging; integrated circuit reliability; millimetre wave receivers; multichip modules; AlN; MCMs; MTTF; NEC; electrical performance; high temperature cofired ceramic; mass productivity; millimeterwave transceiver; radiocommunications systems; reliability; super miniaturized structure; waveguide I/O structure; Ceramics; Circuits; Dielectric losses; Dielectric substrates; National electric code; Packaging; Propagation losses; Radio communication; Temperature; Transceivers;
Conference_Titel :
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-5135-5
DOI :
10.1109/MWSYM.1999.779799
