Title :
Novel three-dimensional vertical interconnect technology for microwave and RF applications
Author :
Goverdhanam, K. ; Simons, R.N. ; Katehi, L.P.B.
Author_Institution :
Radiation Lab., Michigan Univ., Ann Arbor, MI, USA
Abstract :
In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology.
Keywords :
MMIC; UHF integrated circuits; coplanar waveguide components; integrated circuit interconnections; strip line components; 3D vertical interconnect technology; CPS; CPW; IC technology; RF ICs; RF integrated circuits; coplanar stripline; interconnect fabrication process; interconnect modelling; microwave integrated circuits; three-dimensional interconnects; Coplanar waveguides; Fabrication; Finite difference methods; Integrated circuit interconnections; Integrated circuit technology; Microwave technology; Parasitic capacitance; Radio frequency; Silicon; Space technology;
Conference_Titel :
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-5135-5
DOI :
10.1109/MWSYM.1999.779843
