DocumentCode :
3421139
Title :
A ground shielded low loss transmission line using Au-to-Au thermo compressive packaging for RF applications
Author :
Tsaur, Jiunnjye ; Kobayashi, Takeshi ; Murakosi, Y. ; Maeda, Ryutaro ; Suga, Tadatomo
Author_Institution :
National Inst. of Adv. Ind. Sci. & Technol., Tsukuba, Japan
fYear :
2005
fDate :
30 Jan.-3 Feb. 2005
Firstpage :
163
Lastpage :
166
Abstract :
A ground-shielded transmission line consisting of the suspended signal line and the upper and bottom Au-to-Au packaged ground plates was designed, manufactured and tested. The simulation results indicated that the fully ground-shielded scheme could effectively reduce the signal loss resulted from dielectric coupling loss and radiation loss. The fabricated ground-shielded signal line has demonstrated low transmission loss of 0.37dB/mm up to 50GHz in our experiments, which was less than 0.68dB/mm of the conventional coplanar waveguide.
Keywords :
coplanar waveguides; tape automated bonding; transmission lines; 50 GHz; Au; Au-to-Au thermo compressive packaging; RF applications; coplanar waveguide; dielectric coupling loss; ground shielded transmission line; ground-shielded signal line; low loss transmission line; packaged ground plates; radiation loss; signal loss reduction; suspended signal line; transmission loss; Coplanar waveguides; Couplings; Dielectric losses; Manufacturing; Packaging; Propagation losses; Radio frequency; Signal design; Testing; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
ISSN :
1084-6999
Print_ISBN :
0-7803-8732-5
Type :
conf
DOI :
10.1109/MEMSYS.2005.1453892
Filename :
1453892
Link To Document :
بازگشت