Title :
Microassembled tunable MEMS inductor
Author :
Sarkar, N. ; Yan, Daikang ; Horne, E. ; Lu, H. ; Ellis, M. ; Lee, J.B. ; Mansour, R. ; Nallani, A. ; Skidmore, G.
Author_Institution :
Waterloo Univ., Ont., Canada
fDate :
30 Jan.-3 Feb. 2005
Abstract :
In this work we present a heterogeneous microassembly consisting of a MEMS translation stage, a copper electroplated solenoid inductor, and a ferromagnetic NiFe core, integrated on a Pyrex sub-mount. The system was assembled by a 5 degree-of-freedom automated motion control platform using hybrid MEMS assembly technology and a design library of silicon microgrippers, sockets and handles. The tunable inductor was characterized using various core materials from 300 kHz to 20 GHz and has a self-resonant frequency (SRF) of 10 GHz, a Q over 50, and inductance values from 5.5 to 40 nH over its useful frequency range. A nanomagnetic composite material containing Co83.2B3.3Si5.9Mn7.6 exhibited continuous enhancement in inductance and Q up to the self-resonant frequency of the device. The device operates on 7 volts and consumes no quiescent power once it is tuned, due to the power-off engage mechanism incorporated in the translation stage.
Keywords :
boron alloys; cobalt alloys; copper; ferromagnetic materials; inductors; iron alloys; manganese alloys; microassembling; micromechanical devices; nickel alloys; silicon alloys; solenoids; 10 GHz; 300 to 20E6 KHz; 7 V; Co83.2B3.3Si5.9Mn7.6; NiFe; Pyrex sub-mount; automated motion control platform; copper electroplated inductor; design library; ferromagnetic core; heterogeneous microassembly; hybrid MEMS assembly; microassembled MEMS inductor; nanomagnetic composite material; power-off engage mechanism; self-resonant frequency; silicon handles; silicon microgrippers; silicon sockets; solenoid inductor; translation stage; tunable MEMS inductor; Assembly systems; Copper; Frequency; Inductance; Inductors; Microassembly; Micromechanical devices; Motion control; Motion planning; Solenoids;
Conference_Titel :
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
Print_ISBN :
0-7803-8732-5
DOI :
10.1109/MEMSYS.2005.1453897