Analytical models for transient diffusion and activation of ion-implanted boron during rapid thermal annealing considering ramp-up period

Analyzing experimental boron transient diffusion profiles in Si MOSFETs over a wide temperature range with the process simulator TESIM, we evaluated the related transient diffusion time t/sub E/, enhanced diffusivity D/sub enh/, and maximum transient diffusion concentration C/sub enh/. Our extracted values contradict previously reported values, but it is due to the fact that the former works neglected the ramp-up period. We show that considering the ramp-up period is indispensable for the analysis of transient diffusion. We also developed analytical models for t/sub E/, D/sub enh/, and C/sub enh/, and clarified their dependence on physical parameters implemented in TESIM.