Title :
Sub-T bit/s large-capacity ATM MCM switching system design and modules with new low-power Gbit/s I/O circuits
Author :
Kawamura, Tomoaki ; Yamanaka, Naoaki ; Matsumura, Tsuneo ; Ichino, Haruhiko ; Yamaguchi, Chikara ; Kob, Y.
Author_Institution :
NTT Network Service Syst. Labs., Tokyo, Japan
Abstract :
This paper presents a low-power large-capacity ATM switching system design and modules (LSI and MCM). An ATM crosspoint switch LSI for a high-speed large-capacity input and output buffering ATM switching system is developed through the use of 0.5 μm Si bipolar technology. It is confirmed that the LSI attains 25.6 Gbit/s throughput with 32-parallel-signal operation at 800 Mbit/s. The power dissipation of the LSI is only 64% of that of the ATM crosspoint switch LSI with ECL I/Os, by using new bipolar current-mode I/O circuits. The circuits have small voltage swing transmission and a 50 Ω impedance matching scheme at both terminals. They achieve 3.5 Gbit/s operation with half the power dissipation of standard ECL I/Os. The design of the proposed low-power switching system uses MCM technology with a copper-polyimide substrate, 150-μm pitch outer lead TAB and 98-highway flexible printed circuit cables for high-density packaging and high-speed operation. Using these technologies, a 160 Gbit/s ATM switching system with a power dissipation of about 1.3 kW can be achieved for future Broadband ISDN systems. This power is 65% of that of the reported system with ECL I/Os, and can be cooled by forced air with conventional fin-structures
Keywords :
B-ISDN; asynchronous transfer mode; bipolar digital integrated circuits; current-mode logic; electronic switching systems; impedance matching; integrated circuit design; integrated circuit packaging; multichip modules; very high speed integrated circuits; 0.5 mum; 1.3 kW; 150 mum; 160 Gbit/s; 25.6 Gbit/s; 3.5 Gbit/s; 32-parallel-signal operation; 800 Mbit/s; 98-highway flexible printed circuit cables; ATM crosspoint switch LSI; ATM switching system design; Cu; Cu-polyimide substrate; MCM technology; Si; Si bipolar technology; bipolar current-mode I/O circuits; broadband ISDN systems; fin-structures; forced air cooling; high-density packaging; high-speed large-capacity I/O buffering ATM switching system; impedance matching scheme; large-capacity ATM MCM switching system; low-power Gbit/s I/O circuits; modules; outer lead TAB; power dissipation; small voltage swing transmission; Asynchronous transfer mode; Flexible printed circuits; Impedance matching; Large scale integration; Power dissipation; Switches; Switching circuits; Switching systems; Throughput; Voltage;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.540991