Development of a display module using flip chip on flex

Author

Simon, J. ; Gwiasda, J. ; Kuhls, I. ; Werner, K. ; Reichl, H.

Author_Institution

Forschungschwerpunkt Technol. der Mikroperipherik, Tech. Univ. Berlin, Germany

fYear

1995

fDate

4-6 Dec 1995

Firstpage

48

Lastpage

51

Abstract

The reduction of volume and size is an important issue in electronic packaging for portable applications. This requirement can be achieved by the use of bare dies instead of packages. Flip chip on flex was used for a miniature LCD display module to accommodate space limitations. Flip chip bumping was performed with single chips as only a limited number of prototypes was required

Keywords

flip-chip devices; integrated circuit packaging; lead bonding; liquid crystal displays; modules; printed circuit design; printed circuit manufacture; surface mount technology; AuPd; SMT technology; bare dies; electronic packaging; flexible printed circuit; flip chip bumping; flip chip on flex; microcontroller packaging; miniature LCD display module; portable applications; single chips; space limitations; Bonding; Electronics packaging; Flexible printed circuits; Flip chip; Gold; Integrated circuit packaging; Integrated circuit technology; Liquid crystal displays; Nickel; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.540992

Filename

540992