Computer simulation of thick plate multi-point forming process

Multi-point forming (MPF) is an advanced flexible manufacturing technology for three-dimensional sheet metal forming. The substance of MPF is replacing the conventional solid dies by a set of discrete punches called “punch group”. Because the reconfigurable discrete punches are used, part manufacturing costs are reduced and manufacturing time is shortened. However due to the discrete contacts between the workpiece and punches, the dimple defects occurred, which are inevitable and particular for MPF. In this study, the dynamic explicit finite element method was chosen to implement the simulation of MPF process. The method to determine each punch position to construct forming surface was introduced. The MPF process was simulated to study the effect on preventing the surface defects. The experiment was implemented, and it verified that the computer simulation is effective method to suppress the surface defects.