Title :
Extraction of compensated σxx-σyy and σxy stresses from a single four-contact sensor using the spinning transverse voltage method
Author :
Bartholomeyczik, J. ; Kibbel, S. ; Ruther, P. ; Paul, O.
Author_Institution :
Inst. for Microsystem Technol., Freiburg Univ., Germany
fDate :
30 Jan.-3 Feb. 2005
Abstract :
This paper reports on a novel method for extracting two stress components separated from undesired signal contributions with a single four contact piezoresistive structure. To date, such results were obtained only using two separate four contact structures, e.g., Wheatstone bridges of piezoresistors and piezoFETs, or using structures with a larger number of contacts. The method proceeds by spinning the current in the device, similarly to the spinning current method for Hall devices. It features the capability of (i) extracting both σxx-σyy and σxy stresses, (ii) separating the stress dependent signals from other undesired signals, such as Hall voltages, thermoelectric voltages, and temperature dependent effects, and (iii) a straightforward integration into mixed signal systems without the necessity of any compensation of offsets due to the amplifier and A/D conversion stage. Further, the approach is even applicable to nonlinear devices.
Keywords :
electric sensing devices; electromechanical effects; mechanical contact; microsensors; piezoresistance; piezoresistive devices; resistors; stress measurement; σxx-σyy stress; σxy stress; A/D conversion stage; Hall devices; Hall voltages; Wheatstone bridges; amplifier; mixed signal system; nonlinear devices; piezoFET; piezoresistors; signal contributions; single four contact piezoresistive structure; single four contact sensor; spinning current method; spinning transverse voltage method; stress dependent signals; temperature dependent effects; thermoelectric voltages; Bridge circuits; Current measurement; Mechanical sensors; Mechanical variables measurement; Piezoresistance; Sensor phenomena and characterization; Silicon; Spinning; Thermal stresses; Voltage;
Conference_Titel :
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
Print_ISBN :
0-7803-8732-5
DOI :
10.1109/MEMSYS.2005.1453917