• DocumentCode
    3421837
  • Title

    Polyurethane rubber as a MEMS material: characterization and demonstration of an all-polymer two-axis artificial hair cell flow sensor

  • Author

    Engel, J.M. ; Chen, Chann ; Bullen, D. ; Liu, C.

  • Author_Institution
    Micro & Nanotechnology Lab., Illinois Urbana-Champaign Univ., IL, USA
  • fYear
    2005
  • fDate
    30 Jan.-3 Feb. 2005
  • Firstpage
    279
  • Lastpage
    282
  • Abstract
    Characterization and utilization of a two-part room temperature curing polyurethane elastomer as a MEMS material is presented. Chemical resistance, thermal degradation, elastic modulus, and adhesion are tested and compared to the performance of polydimethylsiloxane (PDMS). Polyurethane elastomer is found to exhibit excellent elastic and adhesion performance, with reduced solvent resistance when compared to PDMS. A two-axis artificial hair cell (AHC) is fabricated with carbon impregnated polyurethane force sensitive resistors (FSRs) at the base of a vertical polyurethane cantilever hair. The FSRs transduce the motion of the cilium into a change in resistance via a half-bridge. Device sensitivity is found to be 245 ppm resistance change per micron (ppm/um) of tip deflection.
  • Keywords
    adhesion; carbon; conducting polymers; elastic moduli; mechanical testing; microsensors; rubber; thermal resistance; C; MEMS material; adhesion performance; chemical resistance; cilium; elastic modulus; elastic performance; force sensitive resistors; polydimethylsiloxane; polyurethane elastomer; polyurethane rubber; solvent resistance; thermal degradation; two axis artificial hair cell flow sensor; two part room temperature curing; vertical polyurethane cantilever hair; Adhesives; Chemical sensors; Curing; Hair; Micromechanical devices; Rubber; Sensor phenomena and characterization; Temperature sensors; Thermal degradation; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-8732-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2005.1453921
  • Filename
    1453921