DocumentCode
3422132
Title
Techniques and thermoplastics for encapsulating high performance coils
Author
Patterson, J.F.B. ; Lang, J. ; Hozumi, M.
Author_Institution
DuPont Polymers, Wilmington, DE, USA
fYear
1993
fDate
4-7 Oct 1993
Firstpage
81
Lastpage
83
Abstract
Recent developments in thermoplastic encapsulation materials, molding techniques, and mold design for encapsulating high performance coils are reviewed. Recently developed encapsulation systems for UL 1446 Class F (155 C) and Class H (180 C) applications are discussed
Keywords
coils; 155 degC; 180 degC; UL 1446 Class F; UL 1446 Class H; high performance coils; mold design; molding techniques; thermoplastic encapsulation materials; Assembly; Coils; Electromechanical sensors; Encapsulation; Injection molding; Resins; Solenoids; Stators; Thermal sensors; Transformers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1993. Proceedings., Chicago '93 EEIC/ICWA Exposition
Conference_Location
Chicago, IL
ISSN
1071-6270
Print_ISBN
0-7803-0847-6
Type
conf
DOI
10.1109/EEIC.1993.630950
Filename
630950
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