• DocumentCode
    3422287
  • Title

    Vacuum packaged low noise gyroscope with sub mdeg/s/√Hz resolution

  • Author

    Lee, June-Young ; Jeon, Seung-Hoon ; Jung, Hyoung-Kyoon ; Chang, Hyun-Kee ; Kim, Yong-Kweon

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
  • fYear
    2005
  • fDate
    30 Jan.-3 Feb. 2005
  • Firstpage
    359
  • Lastpage
    362
  • Abstract
    This paper describes a vacuum packaged z-axis gyroscope with sub milli-deg/s/√Hz noise floor. A design rule for the low noise gyroscope is suggested, and lateral vibrating gyroscope was fabricated through a metal interlaid SiOG technology. High aspect ratio (20:1) silicon structures were fabricated without footing damage. The easy method for the electric connection of feed through holes that are 150 μm in diameter is suggested for vacuum package of SiOG structure. The vacuum packaged gyroscope with a quality factor of 10,000 exhibits a noise floor of 0.4 mdeg/s/√Hz, and a bias stability of 4.7 mdeg/s (=17 deg/hour), where the scale factor is 68.5 mV/deg/s with 0.6% linearity error for the range of 200 deg/s.
  • Keywords
    Q-factor; electron device noise; gyroscopes; micromechanical devices; microsensors; silicon; 150 micron; Si; bias stability; high aspect ratio silicon structures; lateral vibrating gyroscope; metal interlaid SiOG technology; quality factor; vacuum packaged low noise gyroscope; vacuum packaged z-axis gyroscope; Electrodes; Fabrication; Glass; Gyroscopes; Packaging; Q factor; Silicon; Substrates; Wafer bonding; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-8732-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2005.1453941
  • Filename
    1453941