• DocumentCode
    3422560
  • Title

    Electroplated thick CoNiMnP permanent magnet arrays for micromachined magnetic device applications

  • Author

    Linkopoulos, T.M. ; Zhang, Wenjin ; Ahn, Chong H.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
  • fYear
    1996
  • fDate
    11-15 Feb 1996
  • Firstpage
    79
  • Lastpage
    84
  • Abstract
    Electroplated thick CoNiMnP permanent magnet arrays for micromachined magnetic device applications have been designed, fabricated, and tested. The electroplated arrays contain 5000 magnets of 40 μm×40 μm×50 μm in a cubic shape on the silicon membrane of 4.6 mm×4.6 mm ×20 μm, where the magnets have shown a fairly high magnetic vertical coercivity of 600 Oe, a retentivity of 0.2-0.3 Teslas, and a maximum energy density of 10 kJ/m 3. Using the electroplated magnet array, a proto-type bi-directional vertical microactuator on silicon membrane has been realized with integrated spiral coils. The magnet arrays realized in this work allow a low power consumption, a flexible bi-directional actuation, as well as a favorable CMOS compatibility
  • Keywords
    CMOS integrated circuits; arrays; cobalt alloys; electroplated coatings; elemental semiconductors; manganese alloys; microactuators; micromachining; nickel alloys; permanent magnets; phosphorus alloys; semiconductor technology; silicon; 0.2 tesla to 0.3 T; 20 mum; 4.6 mm; 40 mum; 50 mum; CMOS compatibility; CoNiMnP; CoNiMnP permanent magnet arrays; Si; Si membrane; bi-directional actuation; electroplated permanent magnet arrays; energy density; integrated spiral coils; magnetic vertical coercivity; micromachined magnetic device; proto-type bi-directional vertical microactuator; retentivity; Bidirectional control; Biomembranes; Coercive force; Magnetic devices; Microactuators; Permanent magnets; Shape; Silicon; Spirals; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1996, MEMS '96, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE, The Ninth Annual International Workshop on
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-2985-6
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1996.493833
  • Filename
    493833