Fine pitch TAB/OLB (Tape Automated Bonding/Outer Lead Bonding) technology by soldering method through non-cleaning process

Author

Matsubara, Hiroshi ; Sakamoto, Yasuhiro ; Yamamura, Keiji ; Nukii, Takashi

Author_Institution

Precision Technol. Dev. Centre, Sharp Corp., Nara, Japan

fYear

1995

fDate

4-6 Dec 1995

Firstpage

72

Lastpage

76

Abstract

The developed technology made it possible to bond the outer leads of the TCP (Tape Carrier Package) at 0.15 mm pitch onto a substrate without a solder supply on the substrate electrodes, which reduces the substrate cost and simplifies the wiring pattern on the substrate, thereby decreasing the electronic noise due to the common electrode pattern for electro-plating. We studied the bonding conditions, materials, reliability and repair techniques, and we confirmed that the technology can be put into practical use

Keywords

circuit reliability; electroplating; environmental factors; fine-pitch technology; integrated circuit packaging; lead bonding; soldering; tape automated bonding; 0.15 mm; CFC free system; bonding conditions; common electrode pattern; electro-plating; electronic noise reduction; fine pitch TAB/OLB; high pin count devices; noncleaning process; outer lead bonding; reliability; repair techniques; soldering method; substrate cost reduction; tape automated bonding; tape carrier package; wiring pattern simplification; Bonding processes; Costs; Electrodes; Electronics packaging; Lead; Liquid crystal displays; Production; Resins; Soldering; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.540997

Filename

540997