Performance of any layer IVH structure multi-layered printed wiring board

Author

Nishii, Toshihiro ; Nakamura, Shinji ; Takenaka, Toshiaki ; Nakatani, Seiichi

Author_Institution

Matsushita Electron. Components Co. Ltd., Osaka, Japan

fYear

1995

fDate

4-6 Dec 1995

Firstpage

93

Lastpage

96

Abstract

We have developed a new multi-layered printed wiring board (ML-PWB) with any layer IVH structure, dubbed “ALIVH”(Any Layer Inner Via Hole). This ALIVH design combines epoxy impregnated non-woven aramid laminates, via hole processing technology using a CO ₂ laser and interconnection technology using conductive copper paste. Non-woven aramid made of extra strong and high thermal resistant aramid fiber has low dielectric constant and is light weight. Non-woven aramid laminates has excellent flatness and low thermal expansion coefficiency in plane. Therefore, ALIVH has a great potential to cope with flip chip bonding technology for MCM-L applications

Keywords

printed circuit manufacture; ALIVH; Any Layer Inner Via Hole; CO₂ laser; MCM-L; any layer IVH structure; conductive copper paste; dielectric constant; epoxy impregnated nonwoven aramid laminate; flatness; flip chip bonding; interconnection; multi-layered printed wiring board; thermal expansion coefficient; thermal resistant fiber; via hole processing; weight; Bonding; Copper; Dielectric constant; Fiber lasers; Flip chip; Laminates; Optical design; Thermal expansion; Thermal resistance; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.541001

Filename

541001