Title :
Assaembly induced failures in thin film MEMS packages
Author :
Zaal, J.J.M. ; van Driel, W.D. ; van Beek, J.T.M. ; Zhang, G.Q.
Author_Institution :
Dept. PME, Delft Univ. of Technol., Delft
Abstract :
In the growing MEMS market wafer level thin film packages can be applied to an increasing number of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.
Keywords :
failure analysis; lead bonding; micromechanical devices; moulding; wafer level packaging; MEMS device; assembly induced failure; dicing; die attachment; grinding process; moulding; wafer level thin film package; wire bonding; Assembly; Hazards; Microelectromechanical devices; Micromechanical devices; Packaging; Testing; Thin film devices; Transistors; Wafer scale integration; Wire;
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
DOI :
10.1109/ESIME.2009.4938408
