Assaembly induced failures in thin film MEMS packages

Author

Zaal, J.J.M. ; van Driel, W.D. ; van Beek, J.T.M. ; Zhang, G.Q.

Author_Institution

Dept. PME, Delft Univ. of Technol., Delft

fYear

2009

fDate

26-29 April 2009

Firstpage

1

Lastpage

5

Abstract

In the growing MEMS market wafer level thin film packages can be applied to an increasing number of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.

Keywords

failure analysis; lead bonding; micromechanical devices; moulding; wafer level packaging; MEMS device; assembly induced failure; dicing; die attachment; grinding process; moulding; wafer level thin film package; wire bonding; Assembly; Hazards; Microelectromechanical devices; Micromechanical devices; Packaging; Testing; Thin film devices; Transistors; Wafer scale integration; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on

Conference_Location

Delft

Print_ISBN

978-1-4244-4160-0

Electronic_ISBN

978-1-4244-4161-7

Type

conf

DOI

10.1109/ESIME.2009.4938408

Filename

4938408