DocumentCode
3422975
Title
A new method of reducing the particle contamination in semiconductor manufacturing
Author
Komagata, Michio
Author_Institution
Niigata Sanyo Electron. Corp. Ltd., Niigata, Japan
fYear
1995
fDate
4-6 Dec 1995
Firstpage
146
Lastpage
149
Abstract
In this paper, a new method of reducing particle contamination in semiconductor manufacturing is suggested. The factors of particle contamination are first listed by dividing the equipment into several blocks and several units. Then, these factors are investigated in order. In such a way, it becomes clear how the equipment generates the particles and where the particles move. Thus, we can take suitable measures to reduce particles
Keywords
semiconductor device manufacture; LSI device yield; particle contamination reduction; particle generation; particle movement; semiconductor manufacturing; Contamination; Electronic equipment manufacture; Failure analysis; Large scale integration; Modems; Particle measurements; Pollution measurement; Pulp manufacturing; Random access memory; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location
Omiya
Print_ISBN
0-7803-3622-4
Type
conf
DOI
10.1109/IEMT.1995.541014
Filename
541014
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