Title :
MEMS reliability: metrology set-up for investigation of fatigue causes
Author :
Millet, Olivier ; Blanrue, Olivier ; Legrand, Bernard ; Collard, Dominique ; Buchaillot, Lionel
Author_Institution :
DELFM EMS, IEMN, Villeneuve d´´Ascq, France
fDate :
30 Jan.-3 Feb. 2005
Abstract :
This paper deals with the investigation of the fatigue causes for polycrystalline structural layers. Metrology is set-up to understand the fatigue phenomenon for polycrystalline materials by targeting the failure mechanisms causes and locations. The tested structures are clamped-clamped beams. It is shown that fatigue is caused by grain modifications near microbridge clamped-ends.
Keywords :
fatigue; mechanical variables measurement; micromechanical devices; reliability; MEMS reliability; clamped-clamped beams; failure mechanism causes; failure mechanism locations; fatigue causes investigation; grain modifications; metrology; microbridge clamped-ends; polycrystalline structural layers; Aging; Commercialization; Electrodes; Fatigue; Microelectronics; Micromechanical devices; Predictive models; Silicon; Temperature; Testing;
Conference_Titel :
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
Print_ISBN :
0-7803-8732-5
DOI :
10.1109/MEMSYS.2005.1453972
