DocumentCode :
3423067
Title :
Coupled 3D thermo-electro-mechanical simulations of microactuators
Author :
Funk, J. ; Korvink, J.G. ; Bächtold, M. ; Bühler, J. ; Baltes, H.
Author_Institution :
Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
fYear :
1996
fDate :
11-15 Feb 1996
Firstpage :
133
Lastpage :
138
Abstract :
We report 3D simulations of microactuators based on the solution of consistently coupled thermo-electro-mechanical equations. The necessary solution algorithms are implemented into the MEMS simulation environment SOLIDIS and allow efficient optimization studies of geometrically complex MEMS devices. Key issues are the solution of coupled equation systems using zone partitioning, adaptive mesh refinement, mesh updating using geometrical algorithms and field smoothing for the extraction of accurate electrostatic forces
Keywords :
digital simulation; electrostatic devices; finite element analysis; mechanical engineering computing; microactuators; optimisation; smoothing methods; 3D simulation; MEMS simulation environment; SOLIDIS; adaptive mesh refinement; coupled thermo-electro-mechanical equations; electrostatic forces; field smoothing; geometrical algorithms; geometrically complex devices; mesh updating; microactuators; micromirror; optimization; zone partitioning; Capacitive sensors; Electrostatic actuators; Equations; Microactuators; Micromechanical devices; Mirrors; Solid modeling; Tensile stress; Thermal conductivity; Thermal force;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1996, MEMS '96, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE, The Ninth Annual International Workshop on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-2985-6
Type :
conf
DOI :
10.1109/MEMSYS.1996.493842
Filename :
493842
Link To Document :
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