Title :
In-situ observation of SAC305 degradation during isothermal mechanical cycling of joint-scale samples
Author :
Herkommer, Dominik ; Reid, Michael ; Punch, Jeff
Author_Institution :
Stokes Inst., Univ. of Limerick, Limerick
Abstract :
This paper investigates the degradation behaviour of lead-free Sn96.5Ag3.0Cu0.5 solder. A series of isothermal mechanical cycling tests under different conditions has been conducted. The tests were monitored in-situ with a high magnification camera system. Optical observations are presented from selected tests, showing the surface morphology during testing. In addition to the optical investigation, the load drop behaviour of the samples is analysed. The result is a deeper insight into the microscale failure behaviour of SAC305 during isothermal cycling.
Keywords :
silver compounds; solders; surface morphology; tin compounds; SAC305 degradation; Sn96.5Ag3.0Cu0.5; isothermal mechanical cycling; joint-scale samples; lead-free solder; surface morphology; Assembly; Cameras; Capacitive sensors; Creep; Degradation; Environmentally friendly manufacturing techniques; Isothermal processes; Lead; Materials testing; Temperature distribution;
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
DOI :
10.1109/ESIME.2009.4938429
