Impact of the UBM geometry and solder bump shape on electromigration reliability in a package system

Author

Zhang, Yuanxiang ; Liang, Lihua ; Chen, Xuefan ; Liu, Yong ; Luk, Timwah ; Irving, Scott

Author_Institution

Fairchild-ZJUT Microelectron. Packaging Joint Lab., Zhejiang Univ. of Technol., Hangzhou

fYear

2009

fDate

26-29 April 2009

Firstpage

1

Lastpage

6

Abstract

This paper proposes a parametric simulation plan for UBM geometry with different UBM rim angles, diameters and thicknesses. The parameter plan for the solder bump with different heights and diameters, and different shapes is also investigated. The goal of this study is to understand the impact of the die shrinkage on solder joint reliability under electromigration failure, and to optimize the UBM and solder bump shapes to reduce the damage of electromigration. A multiple physics finite element method for electromigration which considers the atomic density gradient is presented to conduct the simulation.

Keywords

electromigration; finite element analysis; geometry; gradient methods; integrated circuit packaging; integrated circuit reliability; solders; IC package; UBM rim angles; atomic density gradient; electromigration failure; multiple physics finite element method; solder bump; solder joint reliability; under bump metallization geometry; Electromigration; Finite element methods; Geometry; Metallization; Physics; Robustness; Semiconductor device packaging; Shape; Soldering; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on

Conference_Location

Delft

Print_ISBN

978-1-4244-4160-0

Electronic_ISBN

978-1-4244-4161-7

Type

conf

DOI

10.1109/ESIME.2009.4938432

Filename

4938432