Title : 
A novel fabrication method for hybrid, microfluidic devices
         
        
            Author : 
Steinert, C.P. ; Schmitt, N. ; Deier, E. ; Daub, M. ; deHeij, B. ; Zengerle, R.
         
        
            Author_Institution : 
IMTEK, Freiburg Univ., Germany
         
        
        
            fDate : 
30 Jan.-3 Feb. 2005
         
        
        
        
            Abstract : 
We present a novel fabrication method for hybrid, disposable microfluidic systems. We show its great potential by manufacturing a 24 channel picoliter dispenser, which can be used as disposable for the fabrication of microarrays. Compared to commercially available TopSpot® printheads [Steinert et al., 2004 and Gutmann et al., 2004] silicon area was reduced down to 7% (8×6.4 mm2) and costs were reduced at least by a factor 50. The hybrid disposable assembly consists of a PDMS multilayer containing reservoirs and microchannels (36×20×2 mm3) and a silicon nozzle chip. This way for the first time we were able to realize perfectly sealed high density fluidic interconnects between silicon and PDMS at a pitch of 375 μm. A key for success was the extension of the already known soft lithography and sandwich molding processes for PDMS multilayer fabrication.
         
        
            Keywords : 
microfluidics; moulding; nozzles; soft lithography; 24 channel picoliter dispenser; PDMS multilayer; TopSpot printheads; disposable microfluidic systems; hybrid disposable assembly; hybrid microfluidic devices; microarray fabrication; perfectly sealed high density fluidic interconnects; sandwich molding; silicon nozzle chip; soft lithography; Assembly; Costs; Fabrication; Manufacturing; Microchannel; Microfluidics; Nonhomogeneous media; Reservoirs; Silicon; Soft lithography;
         
        
        
        
            Conference_Titel : 
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
         
        
        
            Print_ISBN : 
0-7803-8732-5
         
        
        
            DOI : 
10.1109/MEMSYS.2005.1453989