Optima design of contact opening for relieving current crowding effect in flip-chip solder joints

Author

Liang, S.W. ; Chen, Chih

Author_Institution

Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu

fYear

2009

fDate

26-29 April 2009

Firstpage

1

Lastpage

3

Abstract

The simulation results show that larger contact opening may not benefit on relieving current crowding effect in the flip-chip solder joints. For the solder joints with a 10-mum thick Cu UBM, the diameter of the contact opening for the lowest current crowding effect is 60 mum. It means that using larger or smaller diameter will increase the current density in the solder bumps. In addition, the optima diameter of the contact opening with a thin-film UBM is larger than that with a thick UBM. In this letter, the optimal design rule of contact opening for relieving current crowding effect in solder joints will be provided.

Keywords

copper alloys; current density; flip-chip devices; metallisation; solders; Cu; current density; flip-chip solder joints; size 10 mum; size 60 mum; solder bumps; under bump metallization; Current density; Design engineering; Electromigration; Flip chip solder joints; Materials science and technology; Packaging; Proximity effect; Soldering; Transistors; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on

Conference_Location

Delft

Print_ISBN

978-1-4244-4160-0

Electronic_ISBN

978-1-4244-4161-7

Type

conf

DOI

10.1109/ESIME.2009.4938445

Filename

4938445