Title :
Primary and tertiary creep properties of eutectic SnAg3.8Cu0.7 in bulk specimens
Author :
Metasch, R. ; Boareto, J.C. ; Roellig, M. ; Wiese, S. ; Wolter, K.-J.
Author_Institution :
Electron. Packaging Lab., Tech. Univ. Dresden, Dresden
Abstract :
The paper presents extended creep properties of eutectic SnAg3.8Cu0.7 solder using dog bone shaped tensile specimen to extend the data for the Alpha-Omega Model. The tensile test machine was carefully modified with respect of solder material requirements in terms of stress free specimen mounting and assurances of high stable stress conditions. Furthermore the tensile tester is able to measure the deformation of the specimen directly on the specimen, which allows more precise tests and more independence from temperature and stress dependent tester parts like the clamping and the rods. The tests were performed in three temperatures: 25degC, 75degC and 125degC and three different stresses at each temperature.
Keywords :
creep; eutectic structure; silver compounds; solders; stress analysis; tensile testing; test equipment; tin compounds; Clech; Sinh Model; alpha-omega model; bulk specimens; clamping; creep properties; deformation measure; dog bone shaped tensile specimen; eutectic solder; exponential strain; rods; solder material requirements; stress conditions; tensile test machine; Bones; Capacitive sensors; Clamps; Creep; Environmentally friendly manufacturing techniques; Lead; Strain measurement; Temperature; Tensile stress; Testing;
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
DOI :
10.1109/ESIME.2009.4938459
