Title :
Modelling of Sn3.0Ag0.5Cu thermo-mechanical behaviour by a continuum damage approach
Author :
Grieu, Marc ; Massiot, Gregor ; Maire, Olivier ; Munier, Catherine ; Bienvenu, Yves ; Renard, Jacques
Author_Institution :
EADS France Innovation Works, Suresnes
Abstract :
A continuum damage model is proposed for Sn3.0Ag0.5Cu solder alloy in pure shear conditions. Experimental tests were performed on specific torsion samples to adjust material parameters of the continuum damage model. The main advantage of this method is to introduce damage process in the mechanical behaviour law of SnAgCu solder. Damage process highly affects the mechanical behaviour of solder alloy during thermal cycle fatigue. Thus, the lifetime of solder can be estimated by using this model without the determination of fatigue laws.
Keywords :
copper alloys; silver alloys; solders; thermal stress cracking; thermomechanical treatment; tin alloys; torsion; SnAgCu; continuum damage approach; solder alloy; thermal cycle fatigue; thermomechanical behaviour; torsion; Thermomechanical processes;
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
DOI :
10.1109/ESIME.2009.4938471
