Title :
Influence of thermal ageing on long term reliability of SnAgCu solder joints
Author :
Dompierre, B. ; Aubin, V. ; Charkaluk, E. ; Filho, W. C Maia ; Brizoux, M.
Author_Institution :
Lab. de Mec. de Lille, Villeneuve d´´Ascq
Abstract :
Reliability of SnAgCu solder joints under mechanical stress is not proven, in particular for Aeronautic and High Performance (AHP) products. They are subjected to high temperatures, severe mechanical stresses and long-term mission profiles. This work is comprehended within a larger study, which has as objective the characterization of the SnAgCu alloys mechanical behaviour at the solder joint scale and the influence of thermal ageing on it. The aim of this first work is to improve the understanding of the relationship between the microstructural and mechanical behaviour evolution of SnAgCu alloys under thermal ageing.
Keywords :
ageing; copper alloys; materials testing; reliability; silver alloys; solders; tin alloys; SnAgCu; mechanical stress; mission profiles; solder joint reliability; solder joint scale; thermal ageing; Aging; Bars; Consumer electronics; Mechanical factors; Microstructure; Soldering; Stress; Temperature; Testing; Thermal management;
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
DOI :
10.1109/ESIME.2009.4938473
