DocumentCode :
3424375
Title :
Analyses of the armature temperature field of synchronouslyinduction coil launcher
Author :
San-qun, Li ; Xiao-cun, Guan ; Zhi-yuan, Lin ; Wei, Han
fYear :
2008
fDate :
3-5 Sept. 2008
Firstpage :
1
Lastpage :
4
Abstract :
In order to study the distribution of temperature field inside the induction coil drive, according to the single stage model of synchronous induction coil launcher, based on the vector magnetism place and the scalar quantity electric potential, the mathematical model of temperature field of conductor area has been established. Adopt the ANSYS finite element software, we have researched the temperature field distribution of synchronous induction coil launcher. The simulation indicates that the magnetic field aberrance is occurred at the after body section of the armature, the eddy mainly distributes at outer surface and after body section of the armature, the direction is contrary with the drive current. The paper shows the distribution law of magnetic field, temperature field as well as energy loss and obtains the method of the optimized design for induction coil drive.
Keywords :
coils; electric potential; electromagnetic launchers; finite element analysis; magnetic fields; temperature distribution; ANSYS finite element software; armature temperature field; energy loss; induction coil drive; magnetic field aberrance; magnetic field distribution law; mathematical model; optimized design; scalar quantity electric potential; synchronous induction coil launcher; temperature field distribution; vector magnetism; Coils; Conductors; Drives; Electric potential; Energy loss; Finite element methods; Magnetic analysis; Magnetic fields; Mathematical model; Temperature distribution; Axis symmetry; Eddy field; Finite element analysis; Mathematic model; Simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vehicle Power and Propulsion Conference, 2008. VPPC '08. IEEE
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-1848-0
Electronic_ISBN :
978-1-4244-1849-7
Type :
conf
DOI :
10.1109/VPPC.2008.4677810
Filename :
4677810
Link To Document :
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