A transient analysis of heat transfer in double stack cold plates

Author

Pieper, Ron J. ; Kraus, Allan D.

Author_Institution

Dept. of Electr. & Comput. Eng., Naval Postgraduate Sch., Monterey, CA, USA

fYear

1997

fDate

9-11 Mar 1997

Firstpage

348

Lastpage

352

Abstract

There is practical interest in the mathematical characterization of the transient performance of heat dissipating extended surfaces to problems in electronic packaging. Although there has been a significant amount of work concentrating on predicting transient behavior in basic monolithic fin structures and shapes, none of these investigations is capable of handling complicated fill structures such as single or double cold-stack plates. As an example illustrating the application of the two-port method for transient analysis, the transient response to a step increase in power dissipation is predicted

Keywords

electronic engineering computing; heat transfer; packaging; transient analysis; basic monolithic fin structures; double stack cold plates; electronic packaging; heat dissipating extended surfaces; heat transfer; mathematical characterization; power dissipation; transient analysis; transient response; Boundary conditions; Cold plates; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Heat transfer; Performance analysis; Resistance heating; Temperature; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

System Theory, 1997., Proceedings of the Twenty-Ninth Southeastern Symposium on

Conference_Location

Cookeville, TN

ISSN

0094-2898

Print_ISBN

0-8186-7873-9

Type

conf

DOI

10.1109/SSST.1997.581660

Filename

581660