Title :
A transient analysis of heat transfer in double stack cold plates
Author :
Pieper, Ron J. ; Kraus, Allan D.
Author_Institution :
Dept. of Electr. & Comput. Eng., Naval Postgraduate Sch., Monterey, CA, USA
Abstract :
There is practical interest in the mathematical characterization of the transient performance of heat dissipating extended surfaces to problems in electronic packaging. Although there has been a significant amount of work concentrating on predicting transient behavior in basic monolithic fin structures and shapes, none of these investigations is capable of handling complicated fill structures such as single or double cold-stack plates. As an example illustrating the application of the two-port method for transient analysis, the transient response to a step increase in power dissipation is predicted
Keywords :
electronic engineering computing; heat transfer; packaging; transient analysis; basic monolithic fin structures; double stack cold plates; electronic packaging; heat dissipating extended surfaces; heat transfer; mathematical characterization; power dissipation; transient analysis; transient response; Boundary conditions; Cold plates; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Heat transfer; Performance analysis; Resistance heating; Temperature; Transient analysis;
Conference_Titel :
System Theory, 1997., Proceedings of the Twenty-Ninth Southeastern Symposium on
Conference_Location :
Cookeville, TN
Print_ISBN :
0-8186-7873-9
DOI :
10.1109/SSST.1997.581660
