DocumentCode
3424606
Title
A fusion approach to IGBT power module prognostics
Author
Patil, Nishad ; Das, Diganta ; Yin, Chunyan ; Lu, Hua ; Bailey, Chris ; Pecht, Michael
Author_Institution
Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD
fYear
2009
fDate
26-29 April 2009
Firstpage
1
Lastpage
5
Abstract
In this paper, a framework for fusion approach to IGBT power module prognostics is reported. A failure modes, mechanisms, and effects analysis (FMMEA) for the IGBT power module is performed to identify critical failure mechanisms. For the failure mechanisms identified, relevant physics of failure models are discussed. In addition, the parameters affected by the critical failure mechanisms are identified that are to be monitored in application. The implementation of this prognostics approach involves precursor parameter monitoring, parameter isolation and trending, and the use of relevant physics of failure models for remaining useful life estimates.
Keywords
insulated gate bipolar transistors; FMMEA; IGBT; failure modes, mechanisms, and effects analysis; fusion approach; power module prognostics; Bonding; Ceramics; Condition monitoring; Copper; Degradation; Failure analysis; Fatigue; Insulated gate bipolar transistors; Multichip modules; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location
Delft
Print_ISBN
978-1-4244-4160-0
Electronic_ISBN
978-1-4244-4161-7
Type
conf
DOI
10.1109/ESIME.2009.4938491
Filename
4938491
Link To Document