• DocumentCode
    3424606
  • Title

    A fusion approach to IGBT power module prognostics

  • Author

    Patil, Nishad ; Das, Diganta ; Yin, Chunyan ; Lu, Hua ; Bailey, Chris ; Pecht, Michael

  • Author_Institution
    Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD
  • fYear
    2009
  • fDate
    26-29 April 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In this paper, a framework for fusion approach to IGBT power module prognostics is reported. A failure modes, mechanisms, and effects analysis (FMMEA) for the IGBT power module is performed to identify critical failure mechanisms. For the failure mechanisms identified, relevant physics of failure models are discussed. In addition, the parameters affected by the critical failure mechanisms are identified that are to be monitored in application. The implementation of this prognostics approach involves precursor parameter monitoring, parameter isolation and trending, and the use of relevant physics of failure models for remaining useful life estimates.
  • Keywords
    insulated gate bipolar transistors; FMMEA; IGBT; failure modes, mechanisms, and effects analysis; fusion approach; power module prognostics; Bonding; Ceramics; Condition monitoring; Copper; Degradation; Failure analysis; Fatigue; Insulated gate bipolar transistors; Multichip modules; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
  • Conference_Location
    Delft
  • Print_ISBN
    978-1-4244-4160-0
  • Electronic_ISBN
    978-1-4244-4161-7
  • Type

    conf

  • DOI
    10.1109/ESIME.2009.4938491
  • Filename
    4938491