• DocumentCode
    3424620
  • Title

    Characterisation and modelling of the nanoindentation experiment in Au layers

  • Author

    Wittler, Olaf ; Mrossko, R. ; Huber, Saskia ; Gollhardt, Astrid ; Michel, Bernd

  • Author_Institution
    Micro Mater. Center, Fraunhofer IZM, Berlin
  • fYear
    2009
  • fDate
    26-29 April 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The nanoindentation experiment is an established technique for the determination of hardness and Young´s modulus of thin films. This standard data set is not sufficient to be used as input to finite element simulations , because elastic-plastic material data is being required for analysis of reliability of metal layers. Therefore stress-strain curves are being determined by fitting the force displacement curves of the experiment with a finite-element model. Additionally this approach enables a solution for the so called substrate effect, because the stiffness of the substrate can be considered in the fitting model. This known approach is being applied and tested on thin (< 500 nm) gold layers deposited on silicon. It is shown that even for indents that exceed 10% of the film thickness a good sensitivity for Young´s modulus can be reached, but for the plastic data the results are not unique and a range of plastic properties can be fitted. It is shown, that this problem of the method can be solved by correlation of the indent profiles.
  • Keywords
    Young´s modulus; finite element analysis; gold; hardness; metallic thin films; nanoindentation; stress-strain relations; Au; Au layers; Young modulus; elastic-plastic material; finite element simulations; force displacement curves; hardness; nanoindentation; reliability; stress-strain curves; substrate effect; Analytical models; Curve fitting; Finite element methods; Gold; Inorganic materials; Materials reliability; Plastics; Substrates; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
  • Conference_Location
    Delft
  • Print_ISBN
    978-1-4244-4160-0
  • Electronic_ISBN
    978-1-4244-4161-7
  • Type

    conf

  • DOI
    10.1109/ESIME.2009.4938492
  • Filename
    4938492