A new method of reliable evaluation on integrated circuit

Due to the increasing of complexity of the packing materials, processes and functions, it´s difficult to quickly and accurately evaluate the reliability of integrated circuit. To solve this problem, a new method for fast evaluation of the reliability and life time of integrated circuits, which is based on ESPI (Electronic Speckle Pattern Interferometer) technology, is presented. This method predicts the specimen life time according to the change of out-of-plane displacement of integrated circuit packing under the condition of accelerated temperature stress. The activation energy of specimen can be extracted rapidly according to the law of speckle candy-stripe varying with specimen temperature, and the working life time of specimen at normal temperature can also be obtained. Experiment results meet the data in reference documents, which demonstrates the feasibility of the proposed method.