Moisture effects on a system in package carrier

Moisture induced failures in the plastic encapsulated packages are one most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85degC/85%RH, 60degC/60%RH and 85 degC/dry, 60 degC/dry using 2D SiP(System in Package) finite element model.