DocumentCode
3424953
Title
Numerical modeling of two proposed mechanically fabricated free-fins heatsinks
Author
Pourian, Jan Bijan ; Irwin, Mark ; Dahlquist, Erik
Author_Institution
Dept. of Energy Tech., Malardalen Univ., Vasteras
fYear
2009
fDate
26-29 April 2009
Firstpage
1
Lastpage
12
Abstract
Two new designs for copper base heat sink is proposed in this work. In some experimental and numerical simulation efforts, optimizing and predicting of the thermal characterization of the heat sink with inclined free fins is developed.
Keywords
convection; cooling; heat sinks; numerical analysis; force convection; free-fins heat sinks; heat dissipation; numerical modeling; thermal characterization; Dielectric substrates; Electronic packaging thermal management; Fatigue; Heat sinks; Multichip modules; Numerical models; Power electronics; Soldering; Thermal management; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location
Delft
Print_ISBN
978-1-4244-4160-0
Electronic_ISBN
978-1-4244-4161-7
Type
conf
DOI
10.1109/ESIME.2009.4938506
Filename
4938506
Link To Document