DocumentCode :
3424953
Title :
Numerical modeling of two proposed mechanically fabricated free-fins heatsinks
Author :
Pourian, Jan Bijan ; Irwin, Mark ; Dahlquist, Erik
Author_Institution :
Dept. of Energy Tech., Malardalen Univ., Vasteras
fYear :
2009
fDate :
26-29 April 2009
Firstpage :
1
Lastpage :
12
Abstract :
Two new designs for copper base heat sink is proposed in this work. In some experimental and numerical simulation efforts, optimizing and predicting of the thermal characterization of the heat sink with inclined free fins is developed.
Keywords :
convection; cooling; heat sinks; numerical analysis; force convection; free-fins heat sinks; heat dissipation; numerical modeling; thermal characterization; Dielectric substrates; Electronic packaging thermal management; Fatigue; Heat sinks; Multichip modules; Numerical models; Power electronics; Soldering; Thermal management; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
Type :
conf
DOI :
10.1109/ESIME.2009.4938506
Filename :
4938506
Link To Document :
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