Applications of FE multi-scale simulations in microelectronics

This paper discusses challenges for multi-scale Finite Element (FE) modeling in microelectronics. Its miniaturization and multi-scale nature is an enabler for in Healthcare and Well-being markets. Function integration and miniaturization enable microelectronic products having functionalities such as rollable display (Figure 1), wireless connectivity & GPS, beaming, illumination systems, body health sensor, DNA analyzer, and many many more. For multi-scale FE modeling, their added value could be in preventing reliability problems and enabling faster functionality integrations in microelectronics resulting in shorter time to market and lower cost.