Study on thick film conductor performances on AlN substrate

For the purpose of development of thick film conductor materials for aluminum nitrate (AlN) substrate, adhesion promoting additives are studied. As a result of this work, it is confirmed that the metal borides worked as adhesion promoting additives without glass frit in thick film conductor composition. The advantages of this paste material are that there is no necessity to prepare oxidized surface of AlN by pre-oxidizing treatment and firing is possible in air atmosphere. In addition, this material has excellent anti-acid treatment performance such as excellent aged adhesion after plating. The results of performance evaluation after plating and the bonding mechanism are discussed in this paper