Smart materials for hybrid circuit and multi chip module

Author

Horowitz, Samuel J. ; Needes, C.R.S.

Author_Institution

DuPont Electron. Mater., Research Triangle Park, NC, USA

fYear

1995

fDate

4-6 Dec 1995

Firstpage

199

Lastpage

204

Abstract

A new generation of “Smart” thick film materials has been developed which extend the capability of conventional thick film technology. High density circuit designs that utilize the unique features of these materials are transitioning from development to full scale manufacturing. This paper reviews these materials and their processing. Diffusion Patterning^TM, Fodel(R) and Green Tape(R) systems, and compatible materials for forming integral buried resistors and capacitors in ceramic thick film interconnects and multichip modules are described. Examples of advanced designs taking advantage of the features of these new materials systems are discussed

Keywords

hybrid integrated circuits; integrated circuit interconnections; intelligent materials; multichip modules; thick film circuits; Fodel; Green Tape systems; diffusion patterning; high density circuit designs; hybrid circuit; integral buried capacitors; integral buried resistors; multi chip module; smart materials; thick film interconnects; Capacitors; Ceramics; Circuits; Costs; Manufacturing; Nonhomogeneous media; Packaging; Resistors; Substrates; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.541027

Filename

541027