DocumentCode
3426381
Title
Theory, technology and assembly of a highly symmetrical capacitive triaxial accelerometer
Author
Lotters, J.C. ; Olthuis, W. ; Veltink, P.H. ; Bergveld, P.
Author_Institution
MESA Res. Inst., Twente Univ., Enschede, Netherlands
fYear
1997
fDate
26-30 Jan 1997
Firstpage
31
Lastpage
36
Abstract
A highly symmetrical cubic easy-to-assemble capacitive triaxial accelerometer for biomedical applications has been designed, realized and tested. The outer dimensions of the sensor are 5×5×5 mm 3 and the device is mounted on a standard IC package. New aspects of the sensor are an easy assembly procedure, the use of the polymers polydimethylsiloxane (PDMS) as spring material between the capacitor plates and the mass and polyimide (PI) as flexible interconnection layer between the capacitor plates, and the highly symmetrical cubic structure. The mathematical model, technology and assembly procedure of the sensor are described. The measurement results show a good linearity in the output voltage for accelerations up to at least 5 g and a bandwidth of DC >50 Hz. In the x-axis the sensitivity was found to be 175 mV/g which is in good correspondence with the theory. The sensitivity can be increased when the PDMS layer is patterned, which was shown in previous versions of the highly symmetrical triaxial accelerometer
Keywords
accelerometers; biomedical equipment; biomedical measurement; electric sensing devices; integrated circuit technology; microsensors; polymer films; semiconductor technology; 50 Hz; PDMS layer; assembly; biomedical applications; capacitor plates; cleanroom technology; cubic easy-to-assemble capacitive triaxial accelerometer; flexible interconnection layer; linearity; mathematical model; mobility control; movement monitoring; output voltage; polymers polydimethylsiloxane; standard IC package; symmetrical capacitive triaxial accelerometer; symmetrical cubic structure; symmetrical triaxial accelerometer; x-axis; Accelerometers; Assembly; Biosensors; Capacitive sensors; Capacitors; Integrated circuit packaging; Polyimides; Polymers; Springs; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
Conference_Location
Nagoya
ISSN
1084-6999
Print_ISBN
0-7803-3744-1
Type
conf
DOI
10.1109/MEMSYS.1997.581760
Filename
581760
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