• DocumentCode
    3426899
  • Title

    Fabrication of three dimensional micro structure composed of different materials using excimer laser ablation and jet molding

  • Author

    Akedo, Jun ; Ichiki, Masaaki ; Kikuchi, Kaoru ; Maeda, Ryutaro

  • Author_Institution
    Mech. Eng. Lab., AIST, Tsukuba, Japan
  • fYear
    1997
  • fDate
    26-30 Jan 1997
  • Firstpage
    135
  • Lastpage
    140
  • Abstract
    Fabrication technology was developed for realization of three dimensional micro structure composed of different materials using excimer laser ablation and ultra fine particle jet molding. This method enables micro devices composed of actuator and sensor materials (PZT) and electrodes (metal). SEM observation and density and electrical property measurement showed a good pattern transfer fidelity with sufficient deposited layer quality (density of better than 85%, dielectric constant of deposited PZT layer of 760). Deposition rate of PZT was much faster than any other deposition techniques and up to 40 μm of thick PZT layer was successfully formed with proper metal electrode structure
  • Keywords
    excimer lasers; laser ablation; lead compounds; masks; microelectrodes; micromechanical devices; piezoceramics; silver; 40 mum; Ag; Ni; actuator; density; dielectric constant; electrical property measurement; electrodes; excimer laser ablation; fabrication technology; jet molding; metal electrode structure; pattern transfer fidelity; sensor materials; thick PZT layer; three dimensional micro structure; ultra fine particle jet molding; Actuators; Density measurement; Dielectric materials; Dielectric measurements; Electric variables measurement; Electrodes; Inorganic materials; Laser ablation; Optical device fabrication; Optical materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
  • Conference_Location
    Nagoya
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-3744-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1997.581787
  • Filename
    581787