Title :
Etching technology for microchannels
Author :
Tjerkstra, R. Willem ; De Boer, Meint ; Berenschot, Erwin ; Gardeniers, J.G.E. ; van den Berg, Albert ; Elwenspoek, Miko
Author_Institution :
MESA Res. Inst., Twente Univ., Enschede, Netherlands
Abstract :
Various ways of fabricating channels in silicon are discussed. Some new channels are presented: the GPSICs and the LPCVD covered channels. Also some attention is paid to the problem of making connections of these channels to the outside world
Keywords :
elemental semiconductors; etching; micromechanical devices; plasma CVD coatings; silicon; wafer bonding; LPCVD covered channels; Si; Si etching; ground plate supported insulating channels; laser induced etching; layer deposition; microchannels; wafer bonding; Anisotropic magnetoresistance; Dry etching; Joining processes; Laboratories; Magnetic heads; Microchannel; Shape; Silicon; Wafer bonding; Wet etching;
Conference_Titel :
Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
Conference_Location :
Nagoya
Print_ISBN :
0-7803-3744-1
DOI :
10.1109/MEMSYS.1997.581790
