Title :
Development of Sn-Pb-Bi solder materials for fine pitch package
Author :
Yamamoto, Ken Ichi ; Lee, Chahn ; Shimokawa, Hanae ; Ishida, Toshiharu ; Soga, Tasao
Author_Institution :
Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan
Abstract :
This paper describes a new solder which is less likely to result in solder bridging. In this research, it was clarified that the bridging was related with surface tension and temperature difference of solidus and liquidus at a solder composition. We have selected 53Sn-2Bi-45Pb solder from results of experiment. Bridging occurrence rate of this solder is less than 1/10 of 63Sn-37Pb solder in cases of 0.5 mm and 0.3 mm pitch QFPs soldering
Keywords :
bismuth alloys; fine-pitch technology; integrated circuit packaging; lead alloys; soldering; surface tension; tin alloys; 0.3 mm; 0.5 mm; QFP; Sn-Pb-Bi; bridging; fine pitch package; liquidus; solder composition; solidus; surface tension; temperature difference; Copper; Electronics packaging; Lead; Mechanical factors; Pins; Printed circuits; Reflow soldering; Semiconductor materials; Temperature; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541033
