DocumentCode :
3427919
Title :
Fabrication of electrophoresis devices on quartz and glass substrates using a bonding with HF solution
Author :
Nakanishi, H. ; Nishimoto, T. ; Nakamura, N. ; Nagamachi, S. ; Arai, A. ; Iwata, Y. ; Mito, Y.
Author_Institution :
Technol. Res. Lab., Shimadzu Corp., Kyoto, Japan
fYear :
1997
fDate :
26-30 Jan 1997
Firstpage :
299
Lastpage :
304
Abstract :
Capillary electrophoresis (CE) devices have been fabricated in a small size on quartz or glass substrates. To fabricate a quartz device, we developed a novel bonding method with HF solution. HF-bonding was carried out with 1% HF solution with a pressure of ~40 gf/cm2. With an evaluation of the new bonding method, we confirm that the method ensures enough strength, air tightness and optical property. An advantage of this method is simplicity of bonding process in comparison with a conventional thermal bonding. Using the glass μCE devices, we obtained the original device design and process procedure through our experiments. It was proved that μCE chip permits to apply higher electric power in comparison with the conventional CE system. We show that our design permits to perform quantitative sample injection (several 10 pl or less), effective separation (the number of theoretical plates is over 2500) and high speed analysis (over 10 times as high as the conventional CE system). These features promise an advantage of μCE devices over conventional analytical equipments
Keywords :
capillarity; chemical analysis; chemical sensors; electrophoresis; glass; hydrogen compounds; micromechanical devices; quartz; semiconductor technology; HF; HF solution; SiO2; bonding; capillary electrophoresis; electric power; electrophoresis devices; glass substrate; glass substrates; high speed analysis; quantitative sample injection; quartz; thermal bonding; Biomedical optical imaging; Bonding processes; Electrokinetics; Electromagnetic wave absorption; Etching; Fabrication; Fluid flow control; Glass; Hafnium; Performance analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
Conference_Location :
Nagoya
ISSN :
1084-6999
Print_ISBN :
0-7803-3744-1
Type :
conf
DOI :
10.1109/MEMSYS.1997.581834
Filename :
581834
Link To Document :
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