DocumentCode :
3427960
Title :
Valve-less diffuser micropumps fabricated using thermoplastic replication
Author :
Olsson, Anders ; Larsson, Olle ; Holm, Johan ; Lundbladh, Lars ; Öhman, Ove ; Stemme, Göran
Author_Institution :
Dept. of Signals, Sensors and Syst., R. Inst. of Technol., Stockholm, Sweden
fYear :
1997
fDate :
26-30 Jan 1997
Firstpage :
305
Lastpage :
310
Abstract :
Here we present the first valve-less diffuser micropumps fabricated using thermoplastic replication. Due to its simple planar geometry the valve-less diffuser pump is very suitable for thermoplastic replication. Two different thermoplastic replication methods have been used: hot embossing and injection molding. As mold inserts we used 0.1 and 0.2 mm deep precision milled brass mold inserts and 20 and 80 μm deep microelectroformed nickel mold inserts defined from deep reactive ion etched (DRIE) silicon wafers. For the injection molding a commercially available Compact Disc injection molding machine (Toolex Alpha MD100) was used to fabricate the diffuser micropumps with extremely short cycle times. One properly fabricated mold insert of nickel can be used to fabricate more than 10000 plastic discs with a cycle time of less than 10 seconds per disc. The plastic material cost is about 5 cents each. Tested pumps reached a maximum volume flow of 1.9 ml/min and a maximum pump pressure of 7.7 kPa
Keywords :
elemental semiconductors; micropumps; nickel; silicon; 0.1 to 0.2 mm; 20 mum; 7.7 kPa; 80 mum; Ni deep microelectroformed mold; Si; Si wafers; Toolex Alpha MD100; deep reactive ion etching; hot embossing; injection molding; planar geometry; plastic discs; thermoplastic replication; valve-less diffuser micropumps; Costs; Embossing; Etching; Geometry; Injection molding; Micropumps; Nickel; Plastics; Silicon; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
Conference_Location :
Nagoya
ISSN :
1084-6999
Print_ISBN :
0-7803-3744-1
Type :
conf
DOI :
10.1109/MEMSYS.1997.581836
Filename :
581836
Link To Document :
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