Title :
A low temperature IC compatible process for fabricating surface micromachined metallic microchannels
Author :
Papautsky, Ian ; Frazier, A. Bruno ; Swerdlow, Herald
Author_Institution :
Dept. of Bioeng., Utah Univ., Salt Lake City, UT, USA
Abstract :
In this paper we describe a method for surface fabrication of metallic microchannels. Arrays of five and seven microchannels have been fabricated using thick photoresist as a sacrificial layer. The microchannels are fabricated on a silicon and glass substrates using nickel as the structural material and gold as the coating of inside walls. Individual microchannels range from 30 μm to 1.5 mm in width, 500 μm to several mm in length, and 13 μm to 30 μm in thickness. The microchannel fabrication technology allows fabrication of relatively large cross sectional surface microchannels using a low temperature process that is compatible with integrated circuit (IC) fabrication technology as a post process
Keywords :
biological techniques; glass; gold; micromachining; nickel; photoresists; silicon; 13 to 40 mum; 30 mum to 1.5 mm; Au; Ni; Si; chromatographic analyser; glass substrates; integrated circuit fabrication technology; low temperature process; microchannels; silicon and glass substrates; surface micromachined metallic microchannels; thick photoresist; Coatings; Fabrication; Glass; Gold; Integrated circuit technology; Microchannel; Nickel; Resists; Silicon; Temperature;
Conference_Titel :
Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
Conference_Location :
Nagoya
Print_ISBN :
0-7803-3744-1
DOI :
10.1109/MEMSYS.1997.581842
